Alpha WS819 Lead-Free Solder Paste

Alpha Metals' SAC305 WS-819 is a water-soluble lead-free solder paste that yields class-leading wetting perfomance under nitrogen. WS-819 will produce lower solder voiding on BGA assemblies than any other water-soluble paste. WS-819 has excellent fine feature printing and an 8 hour stencil life. Flux residues are completely water removeable with minimal foaming. This product contains 96.5%Tin /3.0%Silver /0.5%Copper and is halide-free. Comes packed in a 600 gram, 6" cartridge.