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Alpha 163376, OM-535 Low Temperature No-Clean Lead-Free Solder Paste, Type 4, 500 Gram Jar

Alpha 163376, OM-535 Low Temperature No-Clean Lead-Free Solder Paste, Type 4, 500 Gram Jar

Item #: 03-535-53

Alpha OM-535 is a no-clean low temperature solder paste containing Alpha SBX02 alloy, melting below 140°C and processed in reflow ovens at peak profiles of just 155°-190°C.  This low melting point solder allows usage with temperature sensitive components, flex circuits or for 2nd side reflow of double-sided boards.  OM-535 is the successor to CVP-520 low-temperature solder paste, with higher mechanical strength and Drop Shock Resistance compared to CVP-520 paste.

  • Lead-Free RoHS alloy based on Tin and Bismuth
  • Successor to the older CVP-520 paste, with higher mechanical strength & Drop Shock resistance
  • Melts at <140°C and can reflow with peak of 155°-190°C
  • Compatible with all commonly used lead-free surface finishes, but all components used with OM-535 must be lead-free or a tin/lead/bismuth phase with even lower melting point will form
  • The no-clean flux vehicle delivers 8+ hours stencil life with very low voiding
  • This version contains Type 4 powder for ultra-fine pitch printing
  • 500 gram jar

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Regular price $104.95 Sale

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3+ $100.75

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