Solder Paste - Tin/Lead

9 products

Alpha Metals tin and lead solder pastes are formulated to provide exceptional printing and superior wetting with low voiding.

Alpha Metals tin and lead solder pastes are stocked in Sn63 alloy containing 63% Tin/ 37% Lead. Whether you clean residues off after soldering or run a no-clean process, most of Alpha's SMT pastes are halide-free, which gives the highest level of cleanliness.

Alpha's RMA390 DH3 is the leading mil-spec solder paste for Class III aerospace and high-reliability SMT soldering.

Some formulas of the Alpha Metals tin and lead solder pastes are available in Type 4 powder size for ultra fine-pitch printing. With a laser-cut stencil 5 mil thick, Type 3 Alpha pastes will print QFP parts at pitches as fine as 16 mil (0.4 mm) and 12 mil BGA circles.

Alpha water-soluble pastes have the longest stencil life available to provide consistent printing for up to 5 hours at temperatures from 20 - 28° C.  Alpha's no-clean pastes last more than 8 hours on the stencil.