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Alpha 151855, OM-5300 No-Clean Solder Paste, Sn63, 500g Jar

Alpha 151855, OM-5300 No-Clean Solder Paste, Sn63, 500g Jar

Item #: 03-793-51

Alpha Metals' OM-5300 Fine-Pitch Solder Paste is Alpha's newest, low residue, no-clean solder paste optimized to enhance joint solderability, OM-5300 allows high speed printing down to 0.3mm (12 mil) diameter apertures. It is Halide-Free meeting J-STD ROL0.  This product contains 63%Tin /37%Lead in a Type 3 Powder and is packed in a 500 gram jar.  Alpha item #151855.

Key Features: 

  • Print Consistency: Lower "deposit to deposit" variation drives maximum of first pass print and reflow yields.
  • Fine Feature Capability: High print deposit volumes and low volume variability down to 12 mil (0.30mm) circle feature sizes.
  • Low BGA Voiding
  • Electrical Reliability
  • High print speed, up to 150 mm/sec (6 inch/sec)
  • High yield for in circuit testing (low level of false negatives)
  • This item, Alpha #151855, contains Type 3 solder powder in a 500 gram jar.

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