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Solder Paste - Lead-Free RoHS

Alpha solder pastes are formulated to provide exceptional printing and superior wetting with low voiding.

RoHS lead-free pastes are stocked in SAC305 alloy containing 96.5% Tin/ 3.0% Silver / 0.5% Copper.  Most Alpha SMT pastes are halide-free for the highest level of cleanliness whether you are cleaning post-soldering residues or utilizing a no-clean process.

Some formulas are available in Type 4 powder size for ultra fine-pitch printing. Type 3 Alpha pastes are suitable for printing applications down to 16 mil (0.4 mm) pitch QFP components and 12 mil BGA circles using a 5 mil thick laser cut stencil.

Alpha water-soluble pastes have the longest stencil life available to provide consistent printing for up to 5 hours at temperatures from 20 - 28° C.  Alpha no-clean solder pastes have a stencil life of >8 hours.

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