Alpha 161854, OM-353 No-Clean Lead-Free Solder Paste, SAC305, Type 4, 600g CartridgeItem #: 03-353-61
Assembly processes that can gain from Alpha OM-353 Solder Paste are:
- Assemblies with ultra-fine features
Assemblies sensitive to component warpage
Processes that currently require cleaning
Components sensitive to flux wicking
- Long Stencil Life: engineered for consistent performance in warm/humid production climates, reducing variations in print performance and paste dry-out.
- High Tack Force Life: ensures high pick-and-place yields, good self-alignment.
- Wide Reflow Profile Window: enables quality soldering of complex, high density PWB assemblies in an N2 environment, using high ramp rates and soak profiles as high as 170°C to 180°C.
- Reduced Mid Chip Solder Balling, Head-in-Pillow: minimizes rework and increases first time yield
- Air Reflow Capable: shown to yield good coalescence for 160µm circle deposits using an air reflow high soak.
- Excellent Solder Joint and Flux Residue Cosmetics: residue does not char or burn after.
- Alpha item #161854